NSN: 5962-01-254-5149
Microcircuits, Electronic
MICROCIRCUIT,MEMORY
- Texas Instruments Incorporated
 - Lockheed Martin Corporation
 - Defense Electronics Supply Center
 - Defense Electronics Supply Center
 - Defense Electronics Supply Center
 - Dla Land And Maritime
 - Philips Semiconductors Inc
 - Boeing Company The
 - Boeing Company The
 - Boeing Company The
 - Advanced Micro Devices, Inc.
 - Advanced Micro Devices, Inc.
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 
5962 - Microcircuits, Electronic
MICROCIRCUIT,MEMORY
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Technical Characteristics
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Test Data Document
14933-5962-86703 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)
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Inclosure Configuration
dual-in-line
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Maximum Power Dissipation Rating
633.0 milliwatts
 - 
                                    
Bit Quantity (Non-Core)
256
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Current Rating Per Characteristic
30.00 milliamperes nominal supply
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Features Provided
burn in and 3-state output and hermetically sealed and programmable and monolithic
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Time Rating Per Chacteristic
err-060 nominal hand pull and err-060 nominal hand
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Operating Temp Range
-55.0/+125.0 deg celsius
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Case Outline Source And Designator
d-2 mil-m-38510
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Body Height
0.185 inches maximum
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Word Quantity (Non-Core)
32
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Input Circuit Pattern
6 input
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Voltage Rating And Type Per Characteristic
-0.5 volts minimum power source and 7.0 volts maximum power source
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Memory Device Type
prom
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Memory Capacity
unknown
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Output Logic Form
complementary-metal oxide-semiconductor logic
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Terminal Type And Quantity
16 printed circuit
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Storage Temp Range
-65.0/+150.0 deg celsius
 - 
                                    
Body Length
0.840 inches maximum
 - 
                                    
Body Width
0.220 inches minimum and 0.310 inches maximum
 - 
                                    
Inclosure Material
ceramic
 - 
                                    
Terminal Surface Treatment
solder
 
Related Parts by Category
Related Manufacturers
- Texas Instruments Incorporated
 - Lockheed Martin Corporation
 - Defense Electronics Supply Center
 - Defense Electronics Supply Center
 - Defense Electronics Supply Center
 - Dla Land And Maritime
 - Philips Semiconductors Inc
 - Boeing Company The
 - Boeing Company The
 - Boeing Company The
 - Advanced Micro Devices, Inc.
 - Advanced Micro Devices, Inc.
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 - Dla Land And Maritime
 
    
        Certified toAS6081 Methods
    
    
    
    
    
    

    


