NSN: 5910-01-180-4386

Technical Characteristics

• Test Data Document

  81349-mil-c-11272 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Overall Height

  0.060 inches minimum and 0.100 inches maximum

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Body Style

  chip type

• Overall Width (Non-Core)

  0.110 inches nominal

• Body Length

  0.110 inches nominal

• Specification/standard Data

  81349-mil-c-11272/17 government specification

• Precious Material (Non-Core)

  silver

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Terminal Type And Quantity

  2 bonding pad

• Capacitance Value Per Section

  100.0000 picofarads single section

• Body Width

  0.110 inches nominal

• Precious Material And Location

  terminals silver

• Dissipation Factor At Reference Temp In Percent

  0.0010

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  300.0 dc single section

• Tolerance Range Per Section

  -2.00/+2.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Case Material

  glass

• Quality Factor At Reference Temp

  10000.0000

• Overall Length (Non-Core)

  0.110 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Body Height

  0.060 inches minimum and 0.100 inches maximum