NSN: 5910-01-360-3066

Technical Characteristics

• Test Data Document

  81349-mil-c-55365 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Reliability Failure Rate Level In Percent

  1.000

• Dc Leakage At Maximum Operating Temp

  6.0 microamperes

• Body Length

  3.5 millimeters nominal

• Body Style

  chip type

• Case Material

  ceramic

• Overall Height (Non-Core)

  2.1 millimeters maximum

• Terminal Type And Quantity

  2 bonding pad

• Body Height

  2.1 millimeters maximum

• Reliability Indicator

  established

• Electrical Polarization

  polarized

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Specification/standard Data

  81349-mil-c-55365/9 government specification

• Anode Type

  solid

• Capacitive Electrode Material

  tantalum

• Dissipation Factor At Reference Temp In Percent

  4.000

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Terminal Length

  0.8 millimeters nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Width

  2.8 millimeters nominal

• Overall Width (Non-Core)

  2.8 millimeters nominal

• Equivalent Series Resistance At Reference Temp In Ohms

  11.00

• Overall Length (Non-Core)

  3.5 millimeters nominal

• Capacitance Value Per Section

  0.470 microfarads single section

• Terminal Surface Treatment

  solder

• Dc Leakage At Reference Temp

  0.500 microamperes

• Nonderated Continuous Voltage Rating And Type Per Section

  35.0 dc single section