008-0291-000 TIN DIP

Technical Characteristics

• Surface Treatment

  solder conductor accommodation single layer

• Maximum Conductor Size Accommodated

  11 awg

• Mounting Tongue Width

  0.438 inches

• Basic Shape Style

  solder

• Surface Treatment

  solder mounting facility single layer

• Electrical Insulation Feature

  uninsulated

• Material

  copper alloy conductor accommodation

• Conductor Accommodation Type

  slant lug w/one hole single end

• Mounting Hole Diameter

  0.313 inches

• Mounting Method Style

  ring

• Overall Width

  0.438 inches

• Largest Width

  0.250 inches single end

• Overall Length

  0.828 inches

• Material Thickness

  0.025 inches

• Material

  copper alloy mounting facility

• Mounting Facility Thickness

  0.025 inches